cStack™ Flexible Circuit Assemblies

Amphenol InterCon Systems (Amphenol ICC) cStack™ Flexible Circuit Assemblies are designed for high-speed flex circuit applications where space, weight, and performance are important. This high-speed solderless interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications. The cost-effective, flex stacking products are available in 25- to 100-position standard sizes and are supplied with attached flex stiffener plates and captive screws. Amphenol InterCon Systems (Amphenol ICC) cStack assemblies are ideal for communications, data, industrial and instrumentation, and military applications.