Tflex SF4 Thermal Gap Fillers

Laird Tflex SF4 Thermal Gap Fillers are silicon-free and offer a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity. These gap fillers offer excellent deflection properties, minimizing pressure on components during deflection. A minimal amount of pressure is required to reach the lowest possible thermal resistance. Laird Tflex SF4 Thermal Gap Fillers are designed for datacom systems, automotive electronics, optical modules, and cameras.