UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays

Samtec UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays are 0.635mm pitch high-density, high-speed signal/power arrays that achieve 64Gbps PAM4 speeds. These Samtech signal/power arrays feature rotated power blades for improved performance and simplified breakout region (BOR). These UDx6 AcceleRate MP series features 5mm and 10mm stack heights and up to 10 power and 240 signal positions. The signal/power arrays offer an open-pin-field design for routing and grounding flexibility. The series includes optional alignment pins, standard weld tabs for a secure connection to the board, and polarized guide posts for blind mating.

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Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Bảng dữ liệu
25Dự kiến 07/09/2026
Tối thiểu: 1
Nhiều: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Bảng dữ liệu
25Dự kiến 12/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Bảng dữ liệu
25Dự kiến 20/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Bảng dữ liệu
22Dự kiến 09/11/2026
Tối thiểu: 1
Nhiều: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Bảng dữ liệu
25Dự kiến 19/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Bảng dữ liệu
25Dự kiến 20/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 21/09/2026
Tối thiểu: 1
Nhiều: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 20/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 19/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 19/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 19/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 20/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 07/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 20/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 19/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 19/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
22Dự kiến 19/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 19/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 20/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 20/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 20/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Bảng dữ liệu
25Dự kiến 20/10/2026
Tối thiểu: 1
Nhiều: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Bảng dữ liệu
25Dự kiến 14/09/2026
Tối thiểu: 1
Nhiều: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Bảng dữ liệu
25Dự kiến 14/09/2026
Tối thiểu: 1
Nhiều: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Bảng dữ liệu
Thời gian giao Sản phẩm không Lưu kho 10 Tuần
Tối thiểu: 350
Nhiều: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6