Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.

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EDAC D-Sub High Density Connectors 638W (waterproof) Series vertical D-Sub receptacle connector, 15 machined socket type contacts, #4-40 UNC threaded holes, separate hex standoffs
Bảng dữ liệu
63Có hàng
Tối thiểu: 1
Nhiều: 1

15 Position Solder IP67
EDAC D-Sub Mixed Contact Connectors 627 Series vertical Combo' D-Sub plug connector, 11W1 layout, gold flash plating, solder cup tails, nickel plated shell
Bảng dữ liệu
Không Lưu kho
Tối thiểu: 1
Nhiều: 1
11 Position Solder Tail
EDAC D-Sub High Density Connectors 633M Series right angle D-Sub plug connector, 15 machined pin type contacts, 3.50mm PCB tail length, black insulator
Bảng dữ liệu
Không Lưu kho
Tối thiểu: 1
Nhiều: 1

EDAC D-Sub Standard Connectors 634 Series right angle D-Sub receptacle connector, 44 socket type contacts, 30 microinches of gold plating
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Thời gian giao Sản phẩm không Lưu kho 17 Tuần
Tối thiểu: 1
Nhiều: 1

EDAC D-Sub High Density Connectors 637 Series vertical D-Sub plug connector, 15 pin type contacts, #4-40 UNC threaded standoffs and boardlocks
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Không Lưu kho
Tối thiểu: 1
Nhiều: 1

15 Position Through Hole