Infineon Technologies FS75R17W2E4P_B11 EasyPACK™ Module
Infineon Technologies FS75R17W2E4P_B11 EasyPACK™ Module features a trench/fieldstop IGBT4 and four emitter-controlled diodes with PressFIT/NTC/TIM. The FS75R17W2E4P_B11 offers low switching losses and a low VCE,sat. The device implements PressFIT contact technology and a rugged mounting design via integrated mounting clamps.
Features
- Electrical features
- VCES = 1700V
- IC nom = 75A / ICRM = 150A
- Low switching losses
- Low VCE,sat
- Mechanical features
- Al2O3 substrate with low thermal resistance
- PressFIT contact technology
- Rugged mounting due to integrated mounting clamps
- Compact design
- Pre-applied thermal interface material
Applications
- UPS systems
- Air conditioning
- Motor drives
- Servo drives
- Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068
Associated Products
Infineon Technologies 1700V Dual IGBT Modules
Are qualified for industrial applications according to the tests of IEC 60747, 60749, and 60068.
Infineon Technologies EasyPACK™ 1B IGBT Power Modules
Scalable power module solution with flexible pin grid system perfect for customizing layout/pinout.
Infineon Technologies EasyPACK™ 2B IGBT Power Modules
Scalable power module solution with flexible pin grid system perfect for customizing layout/pinout.
Circuit diagram
Đã phát hành: 2022-10-20
| Đã cập nhật: 2024-07-26