Micron Multichip Packages
Micron Multichip Packages offer critical features and functions for designs, including high performance, high quality, power efficiency, and wide density ranges. Micron Multichip Packages are housed in small package sizes and are available in industrial temperature ranges.
Why MCPs?
Designers must consider performance, power, cost, size, scalability, voltage, reliability and product lifecycle along with selecting the right technologies, density combination, and packages. As a result, designers are increasingly turning to MCP solutions.
Features
- Frees up space on PCBs vs. using multiple discrete packages, leaving room for further application enhancements
- Top-notch quality and performance backed by Micron's rigorous testing techniques
- Withstands extreme temperatures with IT and AAT temperature options
- 5-year+ product longevity commitments on select MCP products
Specifications
- Operating temperature range
- -40°C to +85°C (IT)
- -40°C to +105°C (AAT)
- 100,000 PROGRAM/ERASE cycles
- 1.8V MCPs, ideal for low-power applications
Videos
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Micron NAND-Based MCP
Minimize power consumption, maximize density, and increase speed with NAND MCPs.
Đã phát hành: 2018-07-24
| Đã cập nhật: 2023-03-02