Chip Quik AD7 Thermoset Chip Bonding Epoxy
Chip Quik AD7 Thermoset Chip Bonding Epoxy is designed to bond surface-mount chips and ICs to printed circuit boards (PCBs). The AD7 epoxy has low viscosity and is designed to be dot/line dispensed, allowing large and heavy surface-mount components to be permanently bonded to a PCB during reflow. This application enables two-sided mount reflow without larger chips or ICs coming loose. Curing time ranges from 120 to 180 seconds at the recommended curing temperature range of +190°C to +260°C. The maximum recommended dot size for Chip Quik AD7 Epoxy is 10mm x 10mm x 1mm.
Features
- 120s to 180s for curing time
- +190°C to +260°C recommended curing temperature range
- 10mm x 10mm x 1mm maximum recommended dot size
- -40°C to +125°C operating temperature range
- 44Pa-s viscosity
- >24 months shelf life
- Packaging
- 5g/5cc syringe (AD7-5S)
- 10g/10cc syringe (AD7-10S)
- 30g/30cc syringe (AD7-30S)
- 200g/6oz cartridge (AD7-200S)
Đã phát hành: 2024-08-23
| Đã cập nhật: 2024-10-04