Infineon Technologies CIPOS™ Prime Automotive CoolSiC™ Power Modules
Infineon Technologies CIPOS™ Prime Automotive CoolSiC™ Power Modules are designed for high performance in xEV applications. The devices incorporate automotive-grade CoolSiC MOSFETs in a fully isolated, compact molded package. Furthermore, the power modules support 6.6kW up to 44kW OBC and DC/DC topologies, AEC-Q101 and AQG324 qualified, and offer unmatched reliability, a Poka-Yoke zig-zag pin-out, and a secured supply for next-generation electric vehicle systems.
The Infineon CIPOS Prime Automotive CoolSiC Power Modules combine a broad topology offering with a pin-compatible, drop-in replacement capability, reducing redesign effort while delivering superior CoolSiC MOSFET performance. The enhanced groove design and Poka-Yoke pin-out directly address issues in assembly quality and reliability. AEC-Q101/AQG324 qualification and secured supply allow users to design at scale.
Features
- 1200V Automotive-grade CoolSiC™ MOSFET molded power module optimized for xEV applications
- Fully isolated Dual In-line Package (DIP 44mm x 28mm) in full-bridge and 3-phase bridge configurations
- 4-in-1 and 6-in-1 topologies with an isolated DCB Aluminum Nitride (AlN) package
- Compact, industry-standard form factor with Poka-Yoke zig-zag pin-out design
- Automotive qualified per AEC-Q101 and AQG324
- Wide product portfolio covers 11kW and 22kW OBC and DC/DC topologies with just three module variants
- Improved groove design over market-standard competitors
Applications
- On-board Chargers (OBC)
- DC-DC converter
- HV thermal management
- HVAC
- Industrial drives
- EV-charging
- PSU
- SMPS
Block diagram
Potential applications in xEV
