Infineon Technologies CYT2B9 TRAVEO™ T2G 32-bit Automotive MCUs

Infineon Technologies CYT2B9 TRAVEO™ T2G 32-bit Automotive MCUs are designed for automotive body electronics with processing power and network connectivity built into the Arm® Cortex®-M4F. These MCUs provide higher response and faster communication with the embedded CXPI interface and a CAN FD interface and are ideal for body control modules, HVAC, and lighting. The Infineon TRAVEO devices have advanced security features with the introduction of an HSM (Hardware Security Module), dedicated Cortex®-M0+ for secure processing, and embedded flash in dual bank mode for FOTA requirements. Six power modes enable ECUs to minimize overall power consumption and cutting-edge security features for secure communication with great memory size and pin-count scalability. The MCUs have an optimized software platform for Infineon Autosar MCAL (Microcontroller Abstraction Layer), self-test libraries, Flash EEPROM emulation, and low-level drivers combined with third-party firmware.

Features

  • Dual CPU subsystem
    • 160MHz (maximum) 32-bit Arm® Cortex®-M4F CPU with
      • Single-cycle multiply
      • Single-precision floating point unit (FPU)
      • Memory protection unit (MPU)
    • 100MHz (maximum) 32-bit Arm Cortex M0+ CPU with
      • Single-cycle multiply
      • Memory protection unit
    • Inter-processor communication in hardware
    • 3x DMA controllers
      • Peripheral DMA controller #0 (P-DMA0) with 92x channels
      • Peripheral DMA controller #1 (P-DMA1) with 44x channels
      • Memory DMA controller #0 (M-DMA0) with 4x channels
  • Integrated memories
    • 2112KB of code-flash with an additional 128KB of work-flash
      • Read-While-Write (RWW) allows updating the code-flash/work-flash while executing code from it
      • Single- and dual-bank modes (specifically for Firmware update Over The Air [FOTA])
      • Flash programming through the SWD/JTAG interface
    • 256KB of SRAM with selectable retention granularity
  • Crypto engine (available on select part numbers)
    • Supports Enhanced Secure Hardware Extension (eSHE) and Hardware Security Module (HSM)
    • Secure boot and authentication
      • Using digital signature verification
      • Using a fast secure boot
    • AES: 128-bit blocks, 128-/192-/256-bit keys
    • 3DES: 64-bit blocks, 64-bit key (not available in "eSHE only" parts)
    • Vector unit supporting asymmetric key cryptography such as Rivest-Shamir-Adleman (RSA) and Elliptic Curve (ECC) (not available in "eSHE only" parts)
    • SHA-1/2/3: SHA-512, SHA-256, and SHA-160 with variable length input data
    • CRC: supports CCITT CRC16 and IEEE-802.3 CRC32 (not available in "eSHE only" parts)
    • True random number generator (TRNG) and pseudo-random number generator (PRNG)
    • Galois/Counter Mode (GCM)
  • Functional safety for ASIL-B
    • Memory Protection Unit (MPU)
    • Shared Memory Protection Unit (SMPU)
    • Peripheral Protection Unit (PPU)
    • Watchdog timer (WDT)
    • Multi-counter watchdog timer (MCWDT)
    • Low-voltage detector (LVD)
    • Brown-out detector (BOD)
    • Overvoltage detection (OVD)
    • Clock supervisor (CSV)
    • Hardware error correction (SECDED ECC) on all safety-critical memories (SRAM, flash)
  • Low-power 2.7V to 5.5V operation
    • Low-power Active, Sleep, Low-power Sleep, DeepSleep, and Hibernate modes for fine-grained power management
    • Configurable options for robust BOD
      • 2x threshold levels (2.7V and 3.0V) for BOD on VDDD and VDDA
      • 1x threshold level (1.1V) for BOD on VCCD
  • Wakeup support
    • Up to 2x pins to wakeup from Hibernate mode
    • Up to 152x GPIO pins to wakeup from Sleep modes
    • Event Generator, SCB, Watchdog Timer, RTC alarms to wake from DeepSleep modes
  • Clock sources
    • Internal Main Oscillator (IMO)
    • Internal Low-Speed Oscillator (ILO)
    • External Crystal Oscillator (ECO)
    • Watch Crystal Oscillator (WCO)
    • Phase-Locked Loop (PLL)
    • Frequency-Locked Loop (FLL)
  • Communication interfaces
    • Up to 8x CAN FD channels
      • Increased data rate (up to 8Mbps) compared to classic CAN, limited by physical layer topology and transceivers
      • Compliant to ISO 11898-1:2015
      • Supports all the requirements of Bosch CAN FD specification V1.0 for non-ISO CAN FD
      • ISO 16845:2015 certificate available
    • Up to 8x runtime-reconfigurable SCB (serial communication block) channels, each configurable as I2C, SPI, or UART
    • Up to 12x independent LIN channels, LIN protocol compliant with ISO 17987
    • Up to 4x CXPI channels with data rates up to 20kbps
  • Timers
    • Up to 75x 16-bit and 8x 32-bit timer/counter pulse-width modulator (TCPWM) blocks
      • Up to 12x 16-bit counters for motor control
      • Up to 63x 16-bit counters and 8x 32-bit counters for regular operations
      • Supports timer, capture, quadrature decoding, pulse-width modulation (PWM), PWM with dead time (PWM_DT), pseudo-random PWM (PWM_PR), and shift-register (SR) modes
    • Up to 11x Event Generation (EVTGEN) timers supporting cyclic wake-up from DeepSleep, events trigger a specific device operation (such as execution of an interrupt handler, a SAR ADC conversion, and so on)
  • Real-time clock (RTC)
    • Year/Month/Date, Day-of-week, Hour:Minute:Second fields
    • Supports both 12- and 24-hour formats
    • Automatic leap-year correction
  • I/O
    • Up to 152x programmable I/Os
    • 2x I/O types
      • GPIO Standard (GPIO_STD)
      • GPIO Enhanced (GPIO_ENH)
  • Regulators
    • Generates 1.1V nominal core supply from a 2.7V to 5.5V input supply
    • 2x types of regulators
      • DeepSleep
      • Core internal
  • Programmable analog
    • 3x SAR A/D converters with up to 67x external channels (64x I/Os + 3x I/Os for motor control)
      • ADC0 supports 24x logical channels, with 24x + 1x physical connections
      • ADC1 supports 32x logical channels, with 32x + 1x physical connections
      • ADC2 supports 8x logical channels, with 8x + 1x physical connections
      • Any external channel can be connected to any logical channel in the respective SAR
    • Each ADC supports 12-bit resolution and sampling rates of up to 1Msps
    • Each ADC also supports up to 6x internal analog inputs such as:
      • Bandgap reference to establish absolute voltage levels
      • Calibrated diode for junction temperature calculations
      • 2x AMUXBUS inputs and 2x direct connections to monitor supply levels
    • Each ADC supports addressing external multiplexers
    • Each ADC has a sequencer supporting autonomous scanning of configured channels
    • Synchronized sampling of all ADCs for motor-sense applications
  • Smart I/O
    • Up to 5x Smart I/O blocks, which can perform Boolean operations on signals going to and from I/Os
    • Up to 36x I/Os (GPIO_STD) supported
  • Debug interface
    • JTAG controller and interface compliant with IEEE-1149.1-2001
    • Arm® SWD (serial wire debug) port
    • Supports Arm® Embedded Trace Macrocell (ETM) trace
      • Data trace using SWD
      • Instruction and data trace using JTAG
  • Compatible with industry-standard tools, GHS/MULTI or IAR EWARM for code development and debugging
  • Package options
    • 64-LQFP, 10mm × 10mm × 1.7mm (maximum), 0.5mm lead pitch
    • 80-LQFP, 12mm × 12mm × 1.7mm (maximum). 0.5mm lead pitch
    • 100-LQFP, 14mm × 14mm × 1.7mm (maximum), 0.5mm lead pitch
    • 144-LQFP, 20mm × 20mm × 1.7mm (maximum), 0.5mm lead pitch
    • 176-LQFP, 24mm × 24mm × 1.7mm (maximum), 0.5mm lead pitch
  • Qualified for automotive application according to AEC-Q100

Applications

  • Door control systems
  • Thermal management systems
  • Lighting systems
  • Car access
  • Power distribution
  • Wireless chargers
  • Cockpit domain control sub-systems

Block Diagram

Block Diagram - Infineon Technologies CYT2B9 TRAVEO™ T2G 32-bit Automotive MCUs
Đã phát hành: 2024-06-19 | Đã cập nhật: 2024-06-25