Infineon Technologies KIT_IM69D129FV01_FLEX Evaluation Kit

Infineon Technologies KIT_IM69D129FV01_FLEX Microphone Flex Evaluation Kit is designed for the easy evaluation of the IM69D129FV01 low-power digital XENSIV™ MEMS microphone. This kit consists of five flex boards and one adapter board. The digital flex board includes a digital PDM output microphone and a 0.1µF supply bypass capacitor. The adapter board consists of a 6-position ZIF and a 2.54mm board-to-board connector. One microphone is mounted on each flex board. The included adapter board can easily connect a flex board to an audio testing setup through a 6-position ZIF connector. The KIT_IM69D129FV01_FLEX kit is used to obtain clear audio signals even for high SPL and is ideal for high-precision audio beams applications.