Infineon Technologies XENSIV™ BGT60TR13C Connected Sensor Kit
Infineon Technologies XENSIV™ BGT60TR13C Connected Sensor Kit (KIT_CSK_BGT60TR13) is a rapid prototyping platform for use cases based on the XENSIV BGT60TR13C 60GHz Radar Sensor. The BGT60TR13C is a fully integrated millimeter wave Doppler motion sensor with an antenna in a single package. The Sensor Kit also includes the DPS368 Barometric Pressure Sensor. The DPS368 offers high accuracy, low current consumption, and is capable of measuring both pressure and temperature.
The Infineon Technologies XENSIV™ BGT60TR13C Connected Sensor Kit consists of a compact, Feather-compatible Wing Board and a Rapid IoT Connect Developer Board. The Connected Sensor Kit combines sensing with a low-power dual-core PSoC™ 62M Microcontroller and BLUETOOTH® and Wi-Fi® connectivity options within a software ecosystem provided through ModusToolbox™.
Features
- Small 22.5mm x 63.0mm x 30.0mm Feather-compatible form factor
- Interchangeable sensor Wing Boards can be stacked individually or combined
- Dual-band (2.4GHz and 5.0 GHz) Wi-Fi and Bluetooth 5.0 compliant combo radio module
- OPTIGA™ Trust M for secure authentication of IoT devices
- Key components
- BGT60TR13C 60GHz Radar Sensor
- DPS368 Barometric Pressure Sensor
- PSoC 62M Microcontroller
Resources
On The Board
Infineon Technologies XENSIV™ 60GHz Radar MMIC
A fully integrated microwave motion sensor optimized in size, including AIP.
Infineon Technologies DPS368 Digital XENSIV™ Barometric Pressure Sensor
Designed to be robust against water, dust, and humidity in harsh environments.
Infineon Technologies Bộ vi điều khiển PSoC® 6
MCU PSoC hiệu năng cao với tính năng bảo mật cực cao cho các ứng dụng Internet Vạn vật.
Related Development Tools
Infineon Technologies XENSIV™ PAS CO2 Connected Sensor Kit
Rapid prototyping platform for use cases based on the XENSIV PAS CO2 Sensor.
Board Layout
Wing Board Block Diagram
System Block Diagram
